BAZA WIEDZY

PCB Surface Finishes

Surface Finish Selection Chart

  • Properties
  • OSP

    OSP

    Organic Surface Protection (ENTEK)

  • HAL

    HAL

    Hot Air Levelling, Pb Free (Optional non PB Free HAL), not preferred for fine pitch due to thickness variation

  • Immersion Ni/Au

    Immersion Ni/Au

    Immersion Nickel Gold, ENIG

  • Immersion Ag
  • Immersion Sn
  • Immersion Ni/Pd/Au

    Immersion Ni Pd/Au

    Immersion Nickel Palladium Gold, ENEPIG

  • Thick gold

Production

  • Process Effort
  • Low
  • Medium
  • Medium
  • Medium
  • Medium
  • Medium
  • High
  • Planarity
  • Yes
  • No
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Thickness indication
  • 0,2μm
  • 3-25μm
  • Ni 3–5μm Au 0,05μm
  • Ag 0,125 – 0,65μm
  • 1μm
  • Ni 3–5μm Pd 0,2-0,5μm Au 0,05μm
  • Au 0,7–0,9μm

Application

  • RIGID
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Flex
  • Yes
  • Yes
  • Restricted

    RESTRICTED

    Stiffener to be used to avoid excessive stress on the surface finish due to bending

  • Yes
  • Yes
  • Restricted

    RESTRICTED

    Stiffener to be used to avoid excessive stress on the surface finish due to bending

  • Restricted

    RESTRICTED

    Stiffener to be used to avoid excessive stress on the surface finish due to bending

  • Flex-Rigid
  • Not preferred
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Wire Bonding
  • No
  • No
  • Yes
  • No
  • No
  • Yes
  • Yes
  • Press fit
  • Yes
  • Yes
  • Restricted

    RESTRICTED

    Only in combination with suitable connector, check connector documentation

  • Yes
  • Yes
  • Restricted

    RESTRICTED

    Only in combination with suitable connector, check connector documentation

  • Restricted

    RESTRICTED

    Only in combination with suitable connector, check connector documentation

  • Fine pitch
  • Yes
  • Not preferred
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • HDI - BGA
  • Yes
  • Not preferred
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Multiple Solderability
  • Restricted
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Cost
  • Low
  • Low
  • Moderate
  • Low
  • Low
  • High
  • High
  • Shelf life

    Shelf life

    Storage under the following conditions assumed: Original sealed packaging; Temperature 20-24°C, Relative Humidity 30-40%

  • 3 months
  • 12 months
  • 12 months
  • 6 months
  • 6 months
  • 12 months
  • 12 months
  • Refresh of surface
  • Yes
  • Yes
  • No
  • No
  • Yes
  • No
  • No
  • Handling assembly
  • Gloves preferred
  • Gloves preferred