Below is an in-depth list of Fineline Global’s PCB capabilities. This table will allow you to better understand our capabilities in order the desired outcome is realised.
|
Feature |
Standard |
Advanced |
R&D |
|
Layers count |
16 |
40 |
60 |
|
Minimum board thickness ( with solder mask) |
0.6mm |
0.40mm |
0.20mm |
|
Maximum board thickness |
4mm |
6mm |
10mm |
|
Minimum board size |
50mm x 50mm |
30mm x 30mm |
5mm x 5mm |
|
Maximum board size |
600mm x 570mm |
960mm 600mm |
1250mm x 570mm |
|
Minimum line/space innerlayer (depend on copper weight) |
3mil/3mil |
2.5mil/2.5mil |
2mill/2mil |
|
Minimum line/space outerlayer (depend on copper weight) |
4mil/4mil |
3mil/3mil |
2mil/2mil |
|
Surface finish types |
OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board) |
Plus hard gold (Selective board) soft gold, ENEPIG |
Plus ISIG,EPIG |
|
Mechanical hole size ( Finish hole size) |
0,2 mm |
0,15 mm |
0,1 mm |
|
Maximum aspect ratio PTH |
10 |
16 |
20 |
|
Finished tolerance PTH |
+/-0,075 mm |
+/-0,05 mm |
+/-0,025 mm |
|
Finished tolerance NPTH |
+/-0,05 mm |
+/-0,025 mm |
+/-0,015 |
|
Epoxy filled through holes (Y/N) |
Yes |
Yes |
Yes |
|
Capped via (Y/N) |
Yes |
Yes |
Yes |
|
Maximum copper weight outerlayer |
3oz |
12oz |
>12oz |
|
Maximum copper weight innerlayer |
3oz |
12oz |
>12oz |
|
Control depth drill (Y/N) |
Yes |
Yes |
Yes |
|
Tolerance depth drill |
+/-0,1 mm |
+/-0,075 mm |
+/-0,05 mm |
|
Backdrill diameter |
0,50 mm |
0,35 mm |
0,25 mm |
|
Min. depth of backdrill |
0,25 mm |
0,20 mm |
0,15 mm |
|
Drill depth tolerance |
+/-0,15 mm |
+/- 0,10 mm |
<0,10 mm |
|
HDI type 1+n+1 |
Yes |
Yes |
Yes |
|
HDI type 2+n+2 |
Yes |
Yes |
Yes |
|
HDI type 3+n+3 |
Yes |
Yes |
Yes |
|
HDI type 4+n+4 |
NA |
Yes |
Yes |
|
Any layer |
No |
Yes |
Yes |
|
Min. laser hole diameter |
0.075 |
0.065 |
Only by request |
|
Microvia Max.aspect ratio |
1:1 |
1:1 |
1:1 |
|
Copper filled microvia |
Yes |
Yes |
Yes |
|
Resin filled microvia |
Yes |
Yes |
Yes |
|
Stacked &Staggered via. |
Yes |
Yes |
Yes |
|
Laser via land pad size |
Via diameter+0.15 mm |
Via diameter+0.125 mm |
Via diameter+0.1 mm |
|
Laser via capture pad size |
Via diameter+0.25 mm |
Via diameter+0.225 mm |
Via diameter+0.2 mm |
|
Rigid-flex boards (Y/N) |
Yes |
Yes |
Yes |
|
Min. width between rigid parts |
5 mm |
3mm |
2mm |
|
Min. Flex width |
5mm |
3mm |
2mm |
|
Flex boards (Y/N) |
Yes |
Yes |
Yes |
|
IMS boards |
Yes |
Yes |
Yes |
|
Embedded components (Y/N) |
No |
Yes |
Yes |
|
Soldermask via plugging IPC4761 type VI (Y/N) |
Yes |
Yes |
Yes |
|
Epoxy via plugging IPC4761 type VI(Y/N) |
Yes |
Yes |
Yes |
Download our Capabilities brochure
