Vaardigheden
Technologie
| ITEM | Technical Specifications | |||||||||||||||||||||||||||||
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| Standard | Advanced | Standard | Advanced | |||||||||||||||||||||||||||
| Panel Size | Maximum | 600*730 | 650*1120 mm | 24*29 Inch | 26*44 Inch | |||||||||||||||||||||||||
| Board Thickness |
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| Layer Count |
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| layer to layer registration | minimum missregistration | 0.1 mm | 0.075 mm | 4 mil | 3 mil | |||||||||||||||||||||||||
| copper thickness (inner/outer layers) | Maximum thickness | 210 micron | 420 micron | 6 oz | 12 oz | |||||||||||||||||||||||||
| Minimum core thickness | Minimum core thickness | 50 micron | - | 2 oz | - | |||||||||||||||||||||||||
| Lines/spaces |
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| Mechanical Drilling |
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| Laser Drilling |
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| Impedance control | Accuracy | ± 10% | ± 5% | ± 10% | ± 5% | |||||||||||||||||||||||||
Final finishing
- Soft gold
- Hard gold
- OSP
- ENIG
- HAL
- LF HAL
- Immersion tin
- Immersion silver
- ENEPIG
technologies
- Rigid flex boards including Semi and Regal flex
- Flex boards and multi flex
- HDI Including blind and buried vias
- Back Planes
- Load and Test boards
- Radio Frequency boards Including Teflon and Hybred materials
- Signal integrity and high speed boards
- Imbedded components
- Imbedded resistors and capacitors
- Thermal management
- Coin boards
