Capabilities

Technology

ITEMTechnical Specifications
StandardAdvancedStandardAdvanced
Panel SizeMaximum

600*730

650*1120 mm

24*29 Inch

26*44 Inch

Board Thickness
Maximum
Minimum

7 mm

0.4 mm

10 mm

0.2 mm

0.28 Inch

0.016 Inch

0.39 Inch

0.008 Inch

Layer Count
Maximum layer count rigid boards
Maximum layer count flex boards

36

14

64

20

36

14

64

20

layer to layer registrationminimum missregistration

0.1 mm

0.075 mm

4 mil

3 mil

copper thickness (inner/outer layers)Maximum thickness

210 micron

420 micron

6 oz

12 oz

Minimum core thicknessMinimum core thickness

50 micron

-

2 oz

-

Lines/spaces
Minimum outer layer line/space
Maximum layer count flex boards

75/75 micron

63.5/63.5 micron

50/50 micron

40/40 micron

3/3 mil

2.5/2.5 mil

2/2 mil

1.6/1.6 mil

Mechanical Drilling
Maximum aspect ratio
Minimum drill diameter
final hole tolerance (PTH)
final hole tolerance (NPTH)
Hole location accuracy

1:14

0.15 mm

+0.1, -0.05 mm

± 0.05 mm

± 38 micron

1:20

0.1 mm

± 0.05 mm

± 0.05 mm

± 30 micron

1:14

6 mil

+4, -2 mil

± 2 mil

± 1.5 mil

1:20

4 mil

± 2 mil

± 2 mil

± 1.2 mil

Laser Drilling
Minimum laser diameter
Aspect ratio microvia

75 micron

1:0.8

60 micron

1:1

3 mil

1:0.8

2.4 mil

1:1

Impedance controlAccuracy

± 10%

± 5%

± 10%

± 5%

Final finishing

  • Soft gold
  • Hard gold
  • OSP
  • ENIG
  • HAL
  • LF HAL
  • Immersion tin
  • Immersion silver
  • ENEPIG

technologies

  • Rigid flex boards  including Semi and Regal flex
  • Flex boards and multi flex
  • HDI  Including blind and buried vias
  • Back Planes
  • Load and Test boards
  • Radio Frequency boards  Including Teflon and Hybred materials
  • Signal integrity and high speed boards
  • Imbedded components
  • Imbedded resistors and capacitors
  • Thermal management
  • Coin boards